Engineering
Product Engineering
TASK's product engineering staff have many years of experience helping customers miniaturize their electronic products. The goal of our engineers is to provide customers with the lowest cost solution that encompasses the size, performance, reliability, interconnectivity, environmental and testability requirements of the product. Our product engineers work hand-in-hand with our customers during the proposal, prototyping, design, verification, and preproduction phases of all projects and are always available to ensure that cost reduction and reliability enhancements are the focus throughout the production phase.
Achievements of our Product Engineering group include:
- Design of electronic modules for the first 3-D glasses for IMAX theaters
- World's first successful 3 - stacked chip Digital Hearing Amplifier Hybrid
- Design of electronic modules for the first variable tint eyewear
- World's smallest RF & ultrasonic wildlife tracking transmitters
- Design of high reliability, autoclave resistant electronic module
- World's smallest electronic sensor signal conditioning modules
- Design of ingestible transmitting pH sensor
- World's smallest endoscope camera-mount modules
- Design of the world's first microprocessor controlled lock electronics
- Design of unique opto-electronic and CMOS/CCD camera modules
- Design of the first hand-held blood analyser electronics module
Process Engineering
TASK's process engineers strive to ensure TASK is self-sufficient in all aspects of its manufacturing operations. They specialize in one or more manufacturing area. They become experts in their field and are responsible for all technical activity associated with the manufacturing of our highly specialized products. They are responsible for developing and maintaining specific processes for our products. Process engineering works hand-in-hand with product engineering and quality engineering in the definition, development and qualification of new processes for new products.
Major areas of expertise are:
- Print & Fire of thick film substrates
- Laser Trim & Electrical test
- SMT Assembly
- Chip & Wire Assembly
- Flip Chip Assembly
- Encapsulation & Hermetic Sealing
- Singulation & Dicing
- Optical Component Assembly & Sealing
