TASK’s manufacturing facility is divided into 3 separate clean room environments as well as a surface mount area that offer full ESD control. TASK also manufactures thickfilm hybrid in-house.

Equipment & Process capabilities:

  • Print fire with laser trimming
  • Full surface mount capabilities down to 01/005 component size
  • Automated Die attach
  • Die attach
  • Active trimming of resistors
  • Automated Wire-bonding (Gold/Aluminum/Copper) down to 0.7mil
    • Ball Stitch
    • Deep access
    • Reverse bonding
    • Ribbon
  • Automated epoxy dispensing
  • Dicing
  • Hermetic seam sealing
  • Flip chip
  • BGA