TASK’s product engineering team have a wealth of experience in helping customers miniaturize or ruggedize their new or existing designs.

substrate-technologiesAs TASK works with all substrate technologies:

  • FR4
  • Flex
  • Thickfilm
  • Thinfilm
  • Aluminum Nitride
  • All other form of exotic substrate materials

component-mounting-technologyAnd various forms of component mounting technology:

  • Surface mount
  • Flip Chip
  • BGA
  • Chip of Chip
  • Chip on flip chip

We offer unique electronic packaging solutions based on current available technologies.

#-1---Hybrid-Flip-ChipTASK provides proposed solutions to our customers challenges by first evaluating the following criteria:

  • Overall area calculation
  • Availability of Packaged IC’s bare die form
  • Advanced interconnect solutions
  • Innovative substrate technologies
  • Environmental requirements
  • Design for Manufacturability
  • Design for Test

TASK works hand-in-hand with our customers from initial design layout through Validation, Prototype, Pre-production phases right to full production support.

Worlds smallest medical imagerPast Achievements in electronic packaging design include:

  • 3 dimensionally stacked chip digital hearing amplifier hybrid
  • World’s smallest medical imager
  • Ingestible pH Sensor with RF transmission
  • Autoclavable surgical navigation device
  • Active Implantable sensors